SpanneRS - Gedore
a high-tech grinding machine. Perfect fi t is the most important requirement for non-damaging and safe work. Tolerances achieved by GEDORE Tolerances permitted by DIN standards 1. High-Quality Steel 31CrV3 Highly-effi cient eccentric presses cut the blank for an open-ended spanner from high-quality fl at steel. 3. Thermally Hardened
ESPECIFICACIONES TÉCNICAS - Gob
Página 2 23. Provisión e Instalación de puerta Tol galvanizado e=1.2mm. Incluye marco de tol galvanizado e=1.4mm (0,90 x 2,05 m) Código: PU.MT.000.
Cemento de PVC Gris Especificaciones Técnicas Extra-Reforzado
Cemento de PVC Gris Especificaciones Técnicas Extra-Reforzado Oatey Co. Teléfonos 001 800 321 9532 4700 West 160 th St. Teléfonos 001 800 321 9535
KW CELMM1
er is responsible to evaluate the combination of PCB board and solder paste material for his application. KW CELMM1.TG 16 Version 1.2 | 2021-07-26 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C t S t t P 240 ˚C T p
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gold electrowinning plant
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Data Sheet - Digi-Key
paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evapo-rating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp ...
Technical Data Sheet
EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782 Epoxies and Adhesives for Demanding Applications™ This information is based on data and tests believed to be accurate.
Ceramic Chip Trimmer Capacitors
Recommended thickness of solder paste 0.15mm Part Number JV010 JV025 JV030 JV060 JV100 JV200 JV250 JV450 Capacitance (pF) Minimum 0.5 0.65 1.5 2.5 3.0 4.5 5.5 8.0 Maximum 1.0 2.5 3.0 6.0 10.0 20.0 25.0 45.0 Marking Color None None None None None None None None DC Working Voltage 25 25 25 25 25 25 25 25 DC Withstanding Voltage 55 55 55 55 55 55 ...
CSL1104WBx Series (x=A/B/C/D)
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Automotive very low capacitance ESD protection
5.1 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. "No clean" solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. 5.2 Placement 1. Manual positioning is not recommended. 2.
DOW€CORNING® 732 Multi-Purpose Sealant
0176 Appearance Non-slump paste Color(s) White, black or clear 0364 Extrusion rate¹ g/minute 350 0098 Skinover time minutes 5-10 0095 Tack-free time minutes 20 Physical properties, cured 7 days in air at 25°C (77°F) and 50% relative humidity 0097B D1475 Specific gravity 1.04 0099 D2240 Durometer hardness, Shore A 25 0137A D412 Tensile ...
SOLDER & ACCESSORIES
RA Rosin Flux Paste 13 FLUX REMOVERS How to effectively remove flux residues 14 Heavy Duty Flux Remover 15 Flux Remover for PC Boards 15 Tip tinner 15 DESOLDERING BRAIDS Fine Braid Super Wick 400 Series 16 Fine Braid Super Wick 400 - LF Series 16 Fine Braid Super Wick 400 - NS Series 16 INDUSTRY STANDARDS & REQUIREMENTS 17
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Chain Paste C5 (GB)
A small quantity of paste is enough to lubricate all the chain. Do not apply a thick layer of paste. Spread the paste on the whole chain and especially the inner parts until there is a thin and homogenous layer. MOTUL CHAIN PASTE adheres completely after a few minutes. PROPRETIES Color Visual White Consistency grade ASTM 217 mod NLGI 1
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as metal working, grinding and demolition presents a unique set of needs and challenges, where customized solutions are a must. The TR-600 is designed to be compatible with multiple configurations of headtops, breathing tubes, batteries, filters, cartridges and more. Choose a durable system configuration that gets the job done for you. Endurance
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er is responsible to evaluate the combination of PCB board and solder paste material for his application. KW4 CHLNM2.TK 16 Version 1.1 | 2021-09-01 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C t S t t P 240 ˚C T p
Scotch-Weld Epoxy Adhesive
Scotch-Weld™ Epoxy Adhesive 2216 B/A Technical Data October 2018 Product Description 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength,
109 Flux Thinner - Kester
109 Flux Thinner. Kester 109 Flux Thinner is used for reducing solids or replacing evaporated solvent, resulting in maximum efficiency of the flux. To select a thinner, use the process compatibility information or contact Kester Technical Support. Share Find A Distributor To Buy.
Acid-Cored Wire
Acid-Cored Wire. Kester Acid-Cored Wire is a highly active, inorganic acid type of flux developed for general-purpose soldering applications where a flux-cored solder wire is desirable. Rapid soldering can be accomplished on all common metals except aluminum and manganese. Acid flux is particularly useful for soldering excessively oxidized metals.
CTVS Ceramic transient voltage suppressors
with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is recommended. Multilayer varistor: Structure of silver-platinum termination Multilayer varistors (MLVs) Automotive G series, open mode design
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Dual low capacitance Transil array for ESD protection
4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. "No clean" solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. 2.
KW H4L531 - dammedia.osram.info
er is responsible to evaluate the combination of PCB board and solder paste material for his application. KW H4L531.TE 15 Version 1.5 | 2020-01-30 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C t S t t P 240 ˚C T p
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Single line bidirectional TVS diode for ESD protection
1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 3.5 Reflow profile
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Standard thickness of solder paste : 100 µm to 200 m a b ChipFerriteBead SolderResist Pattern c W D Label H. Spec. No. JENF243A-0004R-01 P.6/9 MURATA MFG.CO., LTD. (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
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Paste-type (Grease) Thermal Conductive GEL Fill gaps around the heat source for improving heat dissipation. Eliminate running and vaporization problems. Easily spreads over heat generating devices. Very soft paste-type (grease)GEL with thermal conducting properties.